| Issue |
EPJ Web Conf.
Volume 335, 2025
EOS Annual Meeting (EOSAM 2025)
|
|
|---|---|---|
| Article Number | 08023 | |
| Number of page(s) | 2 | |
| Section | Topical Meeting - Optical Materials | |
| DOI | https://doi.org/10.1051/epjconf/202533508023 | |
| Published online | 22 September 2025 | |
https://doi.org/10.1051/epjconf/202533508023
Surface Topography and Microstructure of Copper Plating Machined with Single-Crystal Diamond Tool
1 Chiba Institute of Technology, Narashino, Chiba 275-0016, Japan
2 Sendai Nikon Corporation, Natori, Miyagi 981-1221, Japan
3 JTEC Corporation, Ibaraki, Osaka 567-0086, Japan
* Corresponding author: This email address is being protected from spambots. You need JavaScript enabled to view it.
, This email address is being protected from spambots. You need JavaScript enabled to view it.
Published online: 22 September 2025
Abstract
This study investigates the surface characteristics of copper plating machined with a single-crystal diamond tool. The surface topographies of the machined samples were evaluated using WLI and AFM. PSD analysis showed that copper plating is smoother than oxygen-free copper at spatial frequencies below 2 × 10⁴ mm⁻¹. Although the PSD of copper plating was the highest above 2 × 10⁴ mm⁻¹ due to its sand-like texture, this did not significantly affect its RMS roughness. Microstructural analysis using EBSD and XRD revealed that the copper-plated surface consists of fine crystalline grains, likely responsible for the observed texture. These results indicate that copper plating can be smoothly machined and is suitable for use in optical components.
© The Authors, published by EDP Sciences, 2025
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