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Nondestructive Analysis of Buried Interfacial Behaviors of Flux Residue and Their Impact on Interfacial Mechanical Property

Nathan W. Ulrich, John S. Andre, Kunal Khanna, et al.
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6) 982 (2018)
DOI: 10.1109/TCPMT.2018.2826363
See this article