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Cited article:

Enabling photonic system integration by applying glass based microelectronic packaging approaches

Henning Schröder, Wojciech Lewoczko-Adamczyk, Daniel Weber

EPJ Web Conf., 266 (2022) 03020

Published online: 2022-10-13

DOI: https://doi.org/10.1051/epjconf/202226603020

This article has been cited by the following article(s):

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Applied Thermal Engineering 289 129706 (2026)
https://doi.org/10.1016/j.applthermaleng.2026.129706

Recent Progress in Printed Photonic Devices: A Brief Review of Materials, Devices, and Applications

Amal M. Al-Amri
Polymers 15 (15) 3234 (2023)
https://doi.org/10.3390/polym15153234

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