Analysis of Dynamic Plastic Deformation process on an Electrolytic Tough - Pitch copper (Cu-ETP): From material characterization to models improvementJérôme Mespoulet, Bermane Beucia, David Tingaud, Pierre-Louis Hereil, Hervé Couque and Guy DirrasEPJ Web Conf., 183 (2018) 03023DOI: https://doi.org/10.1051/epjconf/201818303023