EPJ Web of Conferences

High temperature indentation behavior of eutectic lead-free solder materials

W.H. Müllera and H. Worrack

EPJ Web of Conferences, 6 (2010) 40009

Published online: 10 June 2010

DOI: 10.1051/epjconf/20100640009

W.H. Müllera

H. Worrack

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