| Issue |
EPJ Web Conf.
Volume 335, 2025
EOS Annual Meeting (EOSAM 2025)
|
|
|---|---|---|
| Article Number | 03037 | |
| Number of page(s) | 2 | |
| Section | Topical Meeting - Applications of Optics and Photonics | |
| DOI | https://doi.org/10.1051/epjconf/202533503037 | |
| Published online | 22 September 2025 | |
https://doi.org/10.1051/epjconf/202533503037
Planar sapphire grinding investigations on a CNC lever machine
1 Ernst-Abbe University of Applied Sciences Jena, Carl-Zeiss-Promenade 2, 07745 Jena, Germany
2 Günter Effgen GmbH, Am Teich 3-5, D-55756 Herrstein, Germany
* Corresponding author: This email address is being protected from spambots. You need JavaScript enabled to view it.
Published online: 22 September 2025
Abstract
The material sapphire is becoming increasingly important in many technical applications. Due to its high hardness, however, high-quality and efficient mechanical processing of the material poses major challenges. Investigations into planar machining with resin-bonded diamond tools on a CNC lever machine setup are presented. The achievable removal rates are shown to be highly dependent on the tool grain size and are adjustable by the grinding parameters in certain ranges. Minimal roughness Rq≈0.15 µm is achievable with fine D28 grain.
© The Authors, published by EDP Sciences, 2025
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