| Issue |
EPJ Web of Conferences
Volume 67, 2014
EFM13 – Experimental Fluid Mechanics 2013
|
|
|---|---|---|
| Article Number | 02109 | |
| Number of page(s) | 4 | |
| Section | Contributions | |
| DOI | https://doi.org/10.1051/epjconf/20146702109 | |
| Published online | 25 March 2014 | |
https://doi.org/10.1051/epjconf/20146702109
Impact of the amount of working fluid in loop heat pipe to remove waste heat from electronic component
University of Žilina, Departure of Power Engineering, Univerzitna 1, 010 26 Žilina, Slovakia
a Corresponding author: martin.smitka@fstroj.uniza.sk
Published online: 25 March 2014
One of the options on how to remove waste heat from electronic components is using loop heat pipe. The loop heat pipe (LHP) is a two-phase device with high effective thermal conductivity that utilizes change phase to transport heat. It was invented in Russia in the early 1980’s. The main parts of LHP are an evaporator, a condenser, a compensation chamber and a vapor and liquid lines. Only the evaporator and part of the compensation chamber are equipped with a wick structure. Inside loop heat pipe is working fluid. As a working fluid can be used distilled water, acetone, ammonia, methanol etc. Amount of filling is important for the operation and performance of LHP. This work deals with the design of loop heat pipe and impact of filling ratio of working fluid to remove waste heat from insulated gate bipolar transistor (IGBT).
© Owned by the authors, published by EDP Sciences, 2014
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