EPJ Web of Conferences
Volume 82, 2015Thermophysical Basis of Energy Technologies
|Number of page(s)||5|
|Published online||20 January 2015|
Investigation of drop dynamic contact angle on copper surface
Department of Theoretical and Industrial Heat Systems Engineering, Institute of Power Engineering, Tomsk Polytechnic University, 634050 Tomsk, Russia
a Corresponding author: firstname.lastname@example.org
Published online: 20 January 2015
This paper presents experimental results of the studying the effect of surface roughness, microstructure and flow rate on the dynamic contact angle at spreading of distilled non deaerate water drop on a solid horizontal substrates. Copper substrates with different roughness have been investigated. For each substrate static contact angles depending on volume flow rate have been obtained using shadow system. Increasing the volume flow rate resulted in an increase of the static contact angle. It was found that with increasing surface roughness dynamic contact angle arises. Also difference in formation of the equilibrium contact angle at low and high rates of drop growth has been detected.
© Owned by the authors, published by EDP Sciences, 2015
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