EPJ Web Conf.
Volume 151, 201716th International Conference on Liquid and Amorphous Metals (LAM-16)
|Number of page(s)||6|
|Section||Structure of liquids|
|Published online||21 August 2017|
The Packing of Helical and Zigzag Chains and Distribution of Interstitial Voids in Expanded Liquid Se near the Semiconductor to Metal Transition
1 Department of Chemistry, Faculty of Science, Niigata University, Niigata 50-2181, Japan
2 Toyota Technological Institute, Nagoya 468-8511, Japan
3 Department of Physics, Faculty of Science, Kyoto University, Kyoto 606-8224, Japan
4 Faculty of Education, Hirosaki University, Hirosaki 036-8560, Japan
5 Research Institute for Science Education, Kyoto 603-8346, Japan
6 Physikalische Chemie, Philipps-Universität Marburg, 35032 Marburg, Germany
* e-mail: email@example.com
Published online: 21 August 2017
The reverse Monte Carlo (RMC) and Voronoi-Delaunay (VD) void analyses were applied to study the modification of chain geometries near the semiconductor (SC) to metal (M) transition in expanded liquid Se along the isochore of d = 3.4 g/cm3.
Fluctuations of dihedral angles with increasing temperature and pressure cause modification of the helical (H) chain to the planar zigzag (Z) chain conformations. The distribution of voids size (rV ) supported by chain segments and distances to the 4th ~ 6th neighbor atoms on the chain segments provide information on the stacking of planar zigzag chains compensated by empty space (L-voids, rV ~ 3.6 Å) which leads to the formation of metallic domains. Near SC-M transition region the number fraction NZ/NH for Z and H chain segments increases.
© The Authors, published by EDP Sciences, 2017
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