EPJ Web Conf.
Volume 215, 2019EOS Optical Technologies
|Number of page(s)||2|
|Section||Manufacturing, Tolerancing and Testing of Optical Systems (MOS) – Session 5|
|Published online||10 September 2019|
Effect of Pad Elastic Modulus on The Polishing Induced Plastic Subsurface Damages Distribution of Fused Silica Optics
Chengdu Fine Optical Engineering Research Center, Chengdu 610041, China
* Corresponding author: email@example.com
Published online: 10 September 2019
The plastic subsurface damages distribution of fused silica optics polished with different pads are investigated. The elastic interaction model, plastic indentation model and wear relationships are combined together to theoretically characterize the plastic subsurface damages distribution in different polishing processes, which shows consistent results with experiments. It reveals that most of the polishing induced subsurface damages are plastic damages. A few largest polishing particles in the tail end distribution mainly decide the final depth distribution and density of the polishing induced plastic subsurface damages. The larger pad elastic modulus will make the few largest polishing particles bear much larger load and generate larger proportion of observable plastic subsurface damages. Using polishing pad with lower elastic modulus is prominent for restricting the generation of fractures and plastic damages.
© The Authors, published by EDP Sciences, 2019
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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