| Issue |
EPJ Web Conf.
Volume 266, 2022
EOS Annual Meeting (EOSAM 2022)
|
|
|---|---|---|
| Article Number | 03020 | |
| Number of page(s) | 2 | |
| Section | Topical Meeting (TOM) 3- Optical System Design, Tolerancing and Manufacturing | |
| DOI | https://doi.org/10.1051/epjconf/202226603020 | |
| Published online | 13 October 2022 | |
https://doi.org/10.1051/epjconf/202226603020
Enabling photonic system integration by applying glass based microelectronic packaging approaches
1 Fraunhofer Institute for Reliability and Microintegration (IZM), Gustav-Meyer-Allee 25, 13355 Berlin, Germany
2 Technical University of Berlin, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
Corresponding author: henning.schroeder@izm.fraunhofer.de
Published online: 13 October 2022
Advanced hybrid packaging technologies are used to enhance functionality of glass-based substrates featuring electrical, thermal and optical components including laser diodes, modulators, isolators, photonic integrated circuits, beam-splitters and micro lenses. Such glass-based substrates can be either thin glass layers on large panels containing optical waveguides or more mini-bench-like boards. Optical fiber interconnects, plugs, and electrical-optical integration platforms are used for higher level system integration. We discuss thin glass as a suitable base material for ion exchanged waveguide panels and interposers, precise glass structuring for posts and holders, electrical wiring and the related high precision assembly techniques.
© The Authors, published by EDP Sciences
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