EPJ Web of Conferences
Volume 6, 2010ICEM 14 – 14th International Conference on Experimental Mechanics
|Number of page(s)||9|
|Section||Digital Image Correlation|
|Published online||10 June 2010|
Measurement of full-field deformation induced by a dc electrical field in organic insulator films
Université de Toulouse; UPS, INPT; LAPLACE (Laboratoire Plasma
et Conversion d’Energie), 118 route de Narbonne,
Toulouse cedex 9,
2 CNRS, LAPLACE, F-31062 Toulouse, France
a e-mail: email@example.com
Digital image correlation method (DIC) using the correlation coefficient curve-fitting for full-field surface deformation measurements of organic insulator films is investigated in this work. First the validation of the technique was undertaken. The computer-generated speckle images and the measurement of coefficient of thermal expansion (CTE) of aluminium are used to evaluate the measurement accuracy of the technique. In a second part the technique is applied to measure the mechanical deformation induced by electrical field application to organic insulators. For that Poly(ethylene naphthalene 2,6-dicarboxylate) (PEN) thin films were subjected to DC voltage stress and DIC provides the full-field induced deformations of the test films. The obtained results show that the DIC is a practical and robust tool for better comprehension of mechanical behaviour of the organic insulator films under electrical stress.
© Owned by the authors, published by EDP Sciences, 2010
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