EPJ Web of Conferences
Volume 6, 2010ICEM 14 – 14th International Conference on Experimental Mechanics
|Number of page(s)||9|
|Section||Digital Image Correlation|
|Published online||10 June 2010|
Measurement of full-field deformation induced by a dc electrical field in organic insulator films
Université de Toulouse; UPS, INPT; LAPLACE (Laboratoire Plasma
et Conversion d’Energie), 118 route de Narbonne,
Toulouse cedex 9,
2 CNRS, LAPLACE, F-31062 Toulouse, France
a e-mail: firstname.lastname@example.org
Digital image correlation method (DIC) using the correlation coefficient curve-fitting for full-field surface deformation measurements of organic insulator films is investigated in this work. First the validation of the technique was undertaken. The computer-generated speckle images and the measurement of coefficient of thermal expansion (CTE) of aluminium are used to evaluate the measurement accuracy of the technique. In a second part the technique is applied to measure the mechanical deformation induced by electrical field application to organic insulators. For that Poly(ethylene naphthalene 2,6-dicarboxylate) (PEN) thin films were subjected to DC voltage stress and DIC provides the full-field induced deformations of the test films. The obtained results show that the DIC is a practical and robust tool for better comprehension of mechanical behaviour of the organic insulator films under electrical stress.
© Owned by the authors, published by EDP Sciences, 2010
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.