EPJ Web of Conferences
Volume 94, 2015DYMAT 2015 - 11th International Conference on the Mechanical and Physical Behaviour of Materials under Dynamic Loading
|Number of page(s)||5|
|Published online||07 September 2015|
On the characterisation of the dynamic compressive behaviour of silicon carbides subjected to isentropic compression experiments
1 Laboratoire Sols Solides Structures – Risques (L3SR), Université Grenoble Alpes, BP. 53, 38041 Grenoble Cedex 9, France
2 CEA, DAM, GRAMAT, BP. 80200, 46500 Gramassst, France
3 DGA Techniques Terrestres, 18021 Bourges Cedex, France
a Corresponding author: firstname.lastname@example.org
Published online: 7 September 2015
Ceramic materials are commonly used as protective materials particularly due to their very high hardness and compressive strength. However, the microstructure of a ceramic has a great influence on its compressive strength and on its ballistic efficiency. To study the influence of microstructural parameters on the dynamic compressive behaviour of silicon carbides, isentropic compression experiments have been performed on two silicon carbide grades using a high pulsed power generator called GEPI. Contrary to plate impact experiments, the use of the GEPI device and of the lagrangian analysis allows determining the whole loading path. The two SiC grades studied present different Hugoniot elastic limit (HEL) due to their different microstructures. For these materials, the experimental technique allowed evaluating the evolution of the equivalent stress during the dynamic compression. It has been observed that these two grades present a work hardening more or less pronounced after the HEL. The densification of the material seems to have more influence on the HEL than the grain size.
© Owned by the authors, published by EDP Sciences, 2015
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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