Analysis of Dynamic Plastic Deformation process on an Electrolytic Tough - Pitch copper (Cu-ETP): From material characterization to models improvement

¹ THIOT INGENIERIE, Route Nationale, 46130 Puybrun, France
² LSPM, CNRS - UPR3407, 99 av. Jean Baptiste Clément – 93430 Villetaneuse
³ NEXTER MUNITIONS, DT/MLA, 7 Route de Guerry, 18023 Bourges Cedex

^* Corresponding author: mespoulet@thiot-ingenierie.com

Published online: 7 September 2018

Abstract

This paper presents a comprehensive study of a direct impact compression loading on an Electrolytic Tough-Pitch copper (Cu-ETP). The aim of the study is to provide reliable experimental data in this dynamic loading using high-speed video camera records and real time projectile deceleration profiles. Test set-up has been optimized to ensure an efficient recovery of the samples after the Dynamic Plastic Deformation (DPD) process in the 10³ to 10⁴ s^-1 strain rate range regime. Structural investigations have been made on post-mortem samples: microstructure investigations of recovered samples have shown more structural changes in terms of crystallographic texture and grain sizes. Post-mortem tensile tests have also been carried out to evaluate yield strength behavior of the Cu-ETP copper after the DPD process. Numerical simulations have been performed to evaluate the ability of empirical models to reproduce recorded signals. In-situ results (time evolution of strain, strain rate, temperature, etc.) given by the numerical analysis have contributed to enrich the post-mortem analysis.