| Issue |
EPJ Web Conf.
Volume 287, 2023
EOS Annual Meeting (EOSAM 2023)
|
|
|---|---|---|
| Article Number | 05014 | |
| Number of page(s) | 2 | |
| Section | Topical Meeting (TOM) 5- Optical Materials | |
| DOI | https://doi.org/10.1051/epjconf/202328705014 | |
| Published online | 18 October 2023 | |
https://doi.org/10.1051/epjconf/202328705014
Probing buried interfaces in SiOxNy thin films via ultrafast acoustics: The role transducing layer thickness
Institute of Plasma Physics of the Czech Academy of Science, Za Slovankou 1782/3, 182 00 Prague 8 - Liben, Czech Republic
* Corresponding author: zidek@ipp.cas.cz
Published online: 18 October 2023
Probing buried interfaces in thin films is a crucial task in many fields, including optical coating. Ultrafast acoustics provide a means to characterize the interfaces by using an acoustic wave localized on the nanometer scale. We provide a brief overview of our thorough study of the interface between SiOxNy thin films and Si substrate by using both single-color and broadband picosecond acoustics. The experiment allows us to track the effect of stoichiometry on the acoustics wave propagation and transition over the layer-substrate interface. To optimize the experiment, we also created simulations to study the effect of optoacoustic layer thickness. We show that the used Ti layer features an optimum thickness between 5-10 nm to reveal details of the interface properties.
© The Authors, published by EDP Sciences, 2023
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