Investigation on Subsurface Damage Patterns in Ultrashort Pulse Laser Machining of Glass using Optical Coherence Tomography

¹ Ernst-Abbe-Hochschule Jena University of Applied Sciences, Fachbereich SciTec, 07745 Jena, Germany
² Günter-Köhler-Institut für Fügetechnik und Werkstoffprüfung GmbH, 07745 Jena, Germany
³ Leibniz-Institut für Oberflächenmodifizierung e.V., 04318 Leipzig, Germany
⁴ TU Dresden, Fakultät Maschinenwesen, Institut für Fertigungstechnik, 01062 Dresden, Germany

^* Corresponding author: samson.frank@eah-jena.de

Published online: 18 October 2023

Abstract

Ultrashort pulse (USP) laser ablation is gaining popularity as a novel manufacturing technique for brittle materials, enabling the creation of complex freeform shapes that are challenging to produce with conventional optics manufacturing techniques. Freeforms have revolutionized optics manufacturing by providing designers with increased degrees of freedom using non-rotational symmetric components. However, this evolution presents new challenges for manufacturing processes, calling for innovative solutions such as USP ablation. To ensure the industrial viability of areal USP laser machining, it is crucial to not only consider material removal rates but also surface quality and subsurface damage (SSD). Especially for optical applications, harsh quality requirements must be met. This study investigates the SSD patterns of fused silica (FS) and borosilicate glass N-BK7 (BK) processed under different laser wavelengths, beam geometries and processing parameters using high-resolution optical coherence tomography (OCT). It is shown that OCT as non-destructive and 3D evaluation method is well-suited for analysing USP processes. The discovered differences in defect morphology between FS and BK emphasize the importance of selecting appropriate processes and process parameters when working with different materials. Compared to previous studies, for the parameter sets analysed here using OCT, much higher defects depths of up to 441 µm were revealed.