EPJ Web of Conferences
Volume 6, 2010ICEM 14 – 14th International Conference on Experimental Mechanics
|Number of page(s)||8|
|Section||Thin Films and Coatings|
|Published online||10 June 2010|
Inﬂuence of microstructure and internal stress on the mechanical behavior of electroplated gold freestanding thin ﬁlms
CNES, 18 av
Toulouse Cedex 9,
2 NOVAMEMS, c/o CNES, DCT/AQ/LE, bpi 1414, 18 Av. Edouard Belin, 31401 Toulouse, France
3 Université de Lyon, INSA-Lyon, INL, CNRS UMR 5270, Villeurbanne, F-69621, France
4 LGP-ENIT, 47 Av. d’Azereix, BP 1629, 65016 Tarbes CEDEX, France
5 INTESENS, 10 Avenue de l’Europe 31520 Ramonville, France
a e-mail: firstname.lastname@example.org
Mechanical properties of freestanding electroplated gold thin ﬁlms were studied in relationship to their geometrical and microstructural properties. Three diﬀerent techniques of characterization were used: nanoindentation, bulge tests and microtensile tests. Results were compared to literature and also discussed according to physical phenomena related to the elaboration process of the specimens like seed layer exodiﬀusion or internal stress state. The observed plasticity and failure mechanisms were found to be in good agreement with the literature and are consistent with the microstructure. The measured Young’s modulus is slightly higher than expected, and SIMS analysis is exploited to explain such a high value.
© Owned by the authors, published by EDP Sciences, 2010
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