| Issue |
EPJ Web Conf.
Volume 270, 2022
QCD@Work 2022 - International Workshop on Quantum Chromodynamics - Theory and Experiment
|
|
|---|---|---|
| Article Number | 00021 | |
| Number of page(s) | 6 | |
| DOI | https://doi.org/10.1051/epjconf/202227000021 | |
| Published online | 17 November 2022 | |
https://doi.org/10.1051/epjconf/202227000021
First bent wafer-scale sensor in truly-cylindrical geometry for the ALICE ITS3 detector
1 Università e INFN, Bari, Italy
* e-mail: arianna.grisel.torres.ramos@cern.ch
Published online: 17 November 2022
An upgrade of the three innermost layers of the ALICE ITS, intended to be installed during the LHC Long Shutdown 3, is under development. The detector concept foresees the usage of curved, wafer-scale Monolithic Active Pixel Sensors. Extensive characterization studies of bent single ALPIDE chips (used for the current ITS), have been carried out to evaluate their performance under the mechanical stress involved in the bending process. These tests on small sensors have opened the way to the investigation of a large scale sensor: a full size demonstrator of a half-layer in a truly cylindrical shape based on so called super-ALPIDE chips. Such activity has required the development of special tools and procedures dedicated to bend and read out the new pixel matrix.
© The Authors, published by EDP Sciences, 2022
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0 (http://creativecommons.org/licenses/by/4.0/).
Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.
Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.
Initial download of the metrics may take a while.