| Issue |
EPJ Web Conf.
Volume 309, 2024
EOS Annual Meeting (EOSAM 2024)
|
|
|---|---|---|
| Article Number | 03026 | |
| Number of page(s) | 2 | |
| Section | Topical Meeting (TOM) 3- Optical System Design, Tolerancing and Manufacturing | |
| DOI | https://doi.org/10.1051/epjconf/202430903026 | |
| Published online | 31 October 2024 | |
https://doi.org/10.1051/epjconf/202430903026
Twyman effect in laser polishing of fused silica wafers
OST Eastern Switzerland University of Applied Sciences, Institute for Microtechnology and Photonics, 9471 Buchs, Switzerland
* Corresponding author: sven.laemmler@ost.chs
Published online: 31 October 2024
This paper investigates the challenges of minimizing wafer deformation during laser polishing of fused silica. The focus is on the Twyman effect, which causes unwanted curvature in thin plates. Strategies to reduce stress-induced deformation are proposed to enhance the reproducibility of the laser polishing process.
© The Authors, published by EDP Sciences, 2024
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